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SOLDER PASTE NO-CLEAN LF 5CC SYR |
Версия для печати
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Серия | CHIPQUIK® |
| Process | Lead Free |
| Тип | Solder Paste |
| Flux Type | No-Clean |
| Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
| Form | Syringe, 15g (0.5 oz) |
| Melting Point | 421°F (216°C) |
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