2283B
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BOARD LEVEL HEAT SINK |
Версия для печати
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
| Тип | Board Level |
| Package Cooled | BGA |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square |
| Length | 0.655" (16.64mm) |
| Width | 0.655" (16.64mm) |
| Height Off Base (Height of Fin) | 0.265" (6.73mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Power Dissipation @ Temperature Rise | 1W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 17.5°C/W @ 300 LFM |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
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