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BOARD LEVEL HEAT SINK |
Версия для печати
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
| Тип | Board Level |
| Package Cooled | TO-5 |
| Attachment Method | Press Fit |
| Shape | Cylindrical |
| Diameter | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD |
| Height Off Base (Height of Fin) | 0.400" (10.16mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Power Dissipation @ Temperature Rise | 1.8W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 14.0°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 21°C/W |