2292BG
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BOARD LEVEL HEAT SINK |
Версия для печати
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Тип | Board Level |
| Package Cooled | BGA |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Cylindrical |
| Diameter | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Power Dissipation @ Temperature Rise | 1.5W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 8.0°C/W @ 400 LFM |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
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