658-60ABT4
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HEATSINK CPU 27.9MM SQ W/ADH BLK |
Версия для печати
| Lead Free Status / RoHS Status | Lead free / RoHS non-compliant |
| Серия | 658 |
| Тип | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square |
| Length | 1.100" (27.94mm) |
| Width | 1.100" (27.94mm) |
| Height Off Base (Height of Fin) | 0.598" (15.20mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Power Dissipation @ Temperature Rise | 2.5W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 2.0°C/W @ 500 LFM |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
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