7173DG
        
        
        
    
    
    
        
            
                                     
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                                BOARD LEVEL HEATSINK .375"TO-220
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Версия для печати
                        
                        
                    
                                
                
                                     
                    
                        Технические характеристики 7173DG
                    
                    
                    
                                                    
                                | Lead Free Status / RoHS Status | Lead free / RoHS Compliant | 
                            
                                                    
                                | Тип | Board Level, Vertical | 
                            
                                                    
                                | Package Cooled | TO-220 | 
                            
                                                    
                                | Attachment Method | Bolt On and PC Pin | 
                            
                                                    
                                | Shape | Rectangular | 
                            
                                                    
                                | Length | 0.750" (19.05mm) | 
                            
                                                    
                                | Width | 0.750" (19.05mm) | 
                            
                                                    
                                | Height Off Base (Height of Fin) | 0.375" (9.52mm) | 
                            
                                                    
                                | Material | Copper | 
                            
                                                    
                                | Material Finish | Tin | 
                            
                                                    
                                | Power Dissipation @ Temperature Rise | 1.5W @ 50°C | 
                            
                                                    
                                | Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM | 
                            
                                                    
                                | Thermal Resistance @ Natural | 25.8°C/W | 
                            
                        
                    
                              
                
                * Представленная техническая информация носит справочный характер и не
                    предназначена для использования в конструкторской документации.