|   | HEATSINK LOW-PROFILE FORGED | 
 Версия для печати
Версия для печати
                        
                        
                    
                                | Lead Free Status / RoHS Status | Lead free / RoHS Compliant | 
| Серия | APF | 
| Тип | Top Mount | 
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | 
| Attachment Method | Thermal Tape, Adhesive (Not Included) | 
| Shape | Square | 
| Length | 1.575" (40.01mm) | 
| Width | 1.575" (40.01mm) | 
| Height Off Base (Height of Fin) | 0.500" (12.70mm) | 
| Material | Aluminum | 
| Material Finish | Black Anodized | 
| Thermal Resistance @ Forced Air Flow | 1.9°C/W @ 200 LFM | 
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